adminAbout Magnesium Silicide Mg2Si Powder:Magnesium silicide is an inorganic compound composed of magnesium and silicon, and the chemical formula is Mg2Si, and the molecular weight is 76.71. Cyan or light purple…
adminAbout Copper Silicide Cu5Si Powder:Copper silicide (Cu5Si), also known as Penta-copper silicide, is a binary compound of silicon and copper. It is an intermetallic compound, which means that its properties lie…
adminAbout Chromium Silicide CrSi2 Powder:Silicide chromium is an inorganic compound that is chemically formula CrSi2. Silicide is a gray cubic crystal, six-square crystal system. The melting point is close to…
adminAbout Tungsten Silicide WSi2 Powder :Tungsten silicide (WSi2) is an inorganic compound, a silicide of tungsten. It is a conductive ceramic material. Tungsten silicide reacts violently with substances between strong…
adminAbout Molybdenum Silicide MoSi2 Powder: MoSi2 is an intermetallic compound, molybdenum silicide is a refractory ceramic, mainly used for heating elements. It has a medium-density, a melting point of 2030 ° C, which is electrically…
adminAbout Cobalt Silicide CoSi2 Powder:Cobalt Silicide is an intermetallic compound, a silicate of cobalt. It is a superconductor with a Ca transition temperature. Cobalt disilicide, chemical formula CoSi2.Molecular weight 115.11.Dark…
adminAbout Hollow Glass Sphere Hollow Glass Beads:What is hollow glass microsphere? Hollow glass microspheres, sometimes termed microballoons or glass bubbles, have diameters ranging from 10 to 300 micrometers. Hollow spheres are…
adminAbout Titanium Silicide Ti5Si3 Powder:Ti5Si3 has good high-temperature stability, high-temperature strength and good oxidation resistance, and is expected to be used in high temperature structural materials above 1300℃.In addition, because of…
adminAbout Iron Disilicide FeSi2 Powder:Iron Disilicide with the chemical form for FeSi2, is an intermetallic compound, is a kind of silicified Iron, in the form of rare mineral Linzhiite exists in…
adminAbout Titanium Silicide TiSi2 Powder:With the rapid development of large integrated circuits (ULSI), the size of the equipment and equipment is getting smaller, the requirements for equipment size, film quality, and thickness…
