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Power chips are linked to exterior circuits via packaging, and their performance depends on the assistance of the product packaging. In high-power situations, power chips are typically packaged as power components. Chip affiliation describes the electric connection on the upper surface area of the chip, which is usually aluminum bonding wire in conventional modules. ^ Conventional power module plan cross-section
At present, business silicon carbide power modules still mainly utilize the packaging technology of this wire-bonded traditional silicon IGBT component. They face troubles such as big high-frequency parasitical criteria, insufficient heat dissipation capability, low-temperature resistance, and inadequate insulation toughness, which restrict the use of silicon carbide semiconductors. The display of outstanding efficiency. In order to fix these troubles and completely make use of the substantial prospective benefits of silicon carbide chips, numerous brand-new packaging innovations and remedies for silicon carbide power components have actually arised in recent times.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually established from gold cord bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold wires to copper cords, and the driving force is expense reduction; high-power devices have established from aluminum cables (strips) to Cu Clips, and the driving force is to boost item efficiency. The better the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to conventional bonding product packaging methods, Cu Clip innovation has the adhering to advantages:
1. The connection between the chip and the pins is constructed from copper sheets, which, to a certain level, replaces the common cable bonding technique in between the chip and the pins. For that reason, an one-of-a-kind bundle resistance worth, greater present flow, and far better thermal conductivity can be gotten.
2. The lead pin welding location does not require to be silver-plated, which can totally conserve the price of silver plating and poor silver plating.
3. The product look is completely consistent with normal products and is generally utilized in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and various other fields.
Cu Clip has 2 bonding techniques.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding technique is much more pricey and complex, however it can attain better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding approach
The resource pad utilizes a Clip method, and the Gate uses a Wire method. This bonding approach is somewhat less expensive than the all-copper bonding technique, conserving wafer area (suitable to extremely little gate areas). The procedure is less complex than the all-copper bonding method and can acquire better Rdson and better thermal effect.
Supplier of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper price today, please feel free to contact us and send an inquiry.
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