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Power chips are linked to exterior circuits via product packaging, and their efficiency depends upon the support of the product packaging. In high-power circumstances, power chips are normally packaged as power components. Chip affiliation describes the electric connection on the top surface of the chip, which is typically light weight aluminum bonding wire in typical modules. ^ Conventional power module plan cross-section
At present, commercial silicon carbide power components still mostly use the product packaging modern technology of this wire-bonded conventional silicon IGBT module. They face issues such as large high-frequency parasitic criteria, inadequate warm dissipation capability, low-temperature resistance, and inadequate insulation toughness, which limit the use of silicon carbide semiconductors. The display screen of superb efficiency. In order to address these issues and fully manipulate the huge potential benefits of silicon carbide chips, several brand-new product packaging innovations and options for silicon carbide power components have emerged recently.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have created from gold cords to copper cables, and the driving pressure is expense reduction; high-power devices have actually created from aluminum cables (strips) to Cu Clips, and the driving force is to improve item efficiency. The higher the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared to typical bonding packaging approaches, Cu Clip technology has the complying with benefits:
1. The connection in between the chip and the pins is made of copper sheets, which, to a certain extent, replaces the common cable bonding approach in between the chip and the pins. For that reason, a distinct package resistance worth, higher current circulation, and better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can fully conserve the price of silver plating and bad silver plating.
3. The item appearance is totally constant with normal products and is primarily used in servers, mobile computer systems, batteries/drives, graphics cards, motors, power products, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding technique is a lot more costly and complicated, however it can attain better Rdson and far better thermal results.
( copper strip)
Copper sheet plus cord bonding method
The source pad makes use of a Clip technique, and eviction utilizes a Wire method. This bonding technique is a little more affordable than the all-copper bonding technique, saving wafer location (applicable to really little entrance locations). The process is simpler than the all-copper bonding technique and can obtain much better Rdson and much better thermal result.
Provider of Copper Strip
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