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The market for iron sputtering target has been experiencing steady growth in recent years due to their widespread adoption in advanced technologies. This trend is expected to continue for the foreseeable future.
Introduction: Sputtering targets are a type of sputtering material that is used to produce thin films. They are produced by a process called plasma ion bombardment. This process removes atoms from the surface of the target by bombarding it with a plasma containing positively charged argon ions and free electrons.
Different purity levels are used for a variety of applications in various industries. Higher purity levels are preferred for more complex applications that require high accuracy and precision.
Iron Selenide (FeSe) Sputtering Targets: ALB Materials Inc produces Iron Selenide (FeSe) sputtering targets in different shapes, sizes and purities. Typical products include circular, rectangle, column, step and custom shape.
ALB Materials also manufactures cylindrical sputtering targets that are machined out of rectangular slabs or ingots. This enables them to have higher pass through flux (PTF) when they are later used in a particular sputtering process.
Grain orientation of the sputtering target is selected and controlled to enhance the pass through flux for a particular sputtering process. The sputtering target is then rolled and heat treated several times to align the grains of its microstructure and thereby improve its sputtering performance.
The melted sputtering target material is then poured into the pour cup 21, which flows through runners 21 a into each mold 20 and fills its mold cavity 22. A crystal selector passage 30 or single crystal seed is provided in each mold 20 to permit only a single crystal to propagate into the melted sputtering target material and solidify epitaxially through the mold 20.