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Thermal management is one of the most important issues for the life and reliability of electronic devices. In order to achieve an optimal cooling effect, it is necessary to disperse the generated heat by natural or forced convection. A ceramic heat sink is able to offer both options in a compact and slim structure.
The unique micro hole structure of the ceramic increases the surface area of contact with the air, thus greatly improving the cooling performance of the device. It can be used in the condition of natural convection or forced convection with the use of a fan. In both cases the ceramic has a better cooling effect than super copper and aluminum, due to its superior thermal conductivity and high rate of radiation.
Beryllium oxide ceramics (BeO) offer a combination of superb thermal, dielectric and mechanical properties which make them a suitable material for electronic heat sinks. They are comparable with the most conductive metals, are non-toxic, have excellent electrical isolation and are corrosion resistant and stable.
Moreover, the BeO is also extremely thin which makes it an ideal choice for narrow applications. It is easy to assemble, with pre-applied thermal paste or adhesive tape, which further reduces production time and assembly costs. It has a low linear temperature expansion coefficient, is humidity proof and dust proof as well as being environmentally friendly and durable. In addition, the BeO is non-electrically conductive and therefore has no electrostatic coupling noise current shifts from IC components that can cause electromagnetic interference (EMI). Besides these benefits, it has very good chemical resistance as well as being anti-oxidation and corrosion resistant.